- Journal
- SENSORS AND ACTUATORS A-PHYSICAL
- Année
- 2010
- Volume
- 164
- Numéro
- 1-2
- Pages
- 125-130
- Mois
- NOV-DEC
- DOI
- 10.1016/j.sna.2010.09.013
Abstract
This paper presents the design fabrication and testing of a new two-dimensional pneumatic conveyor for micro-chips manipula ion The conveyor can levitate and move flat objects to a desired position using controlled air-flow The structure consists of a sandwich of silicon-silicon-Pyrex layers fabricated using MEMS technologies in which deep reactive ion etching (DRIE) and ultrasonic micro-machining techniques were used for the fabrication of silicon and Pyrex chips respectively The silicon-silicon wafers and silicon-Pyrex wafers were bonded by gold eutectic bonding and anodic bonding techniques respectively The device array 1, about 9 mm x 9 mm of surface dimension and composed of 8 x 8 pneumatic micro-conveyors A micro-conveyor has four nozzles that can generate inclined air-jets allowing four conveyance directions We demonstrate experimentally that a 3 mm diameter object of 2 mg weight can be conveyed to a desired position with intermittent air-flow of 20 kPa (c) 2010 Elsevier B V All rights reserved